We also have subordinate factory, that is capable of manufacturing OEM electronic products
The factory are equipped with the whole sets of complete production lines and advanced accurate testing facilities. Our factory has been certified by ISO9001:2000 & 14000 system and we have won customers from Europe, USA, Japan and Korea and etc.
| Quality Guarantee(1) |
| Facilities for quality guarantee: To make sure reliable quality, our factory has been equipped with sets of testing facilities, including Constant temperature and humidity test machine, Vibration test machine, Carton compression tester, Salt spray tester and etc. |
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| Quality Guarantee(2) |
| With the market developing directions, in order to orient our products to a high-end market with stricter quality requirement, our company has invested in some high-end production equipments and testing facilities. |
| 1）To meet the requirement of ROHS and related environmental directives that requires all the products exported to European or US markets must be compliance with, our company has invested in EDX8600 tester for incoming material inspections. |
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| Data sheet： |
| * Testing energy resolution：149+5EV |
| * Maximum Output for High Voltage Power Supply：50W （Voltage： 5-50KV, Current：50-1000UA） |
| * Maximum output current for X-Ray tube：1mA |
| * Sample chamber size：610mmX320mmx100mm |
| * Working temperature：15-30℃ |
| * Working current：AC 220V+5V |
| *Output Power：≤100W |
| *Equipment weight：68Kg |
| * Elements measuring scope：from sulphur (S) to uranium (U) |
| * Elements content analyzing scope： 2ppm-99.99% |
| * Testing time：100-300S (adjustable) |
| * Seven kinds of optical correction system, automatically controlled by software |
| * Safety protection mode |
| * Testing software aiming at ROHS and related environmental directives |
| It can not only apply to RoHS, but also apply to tests for halogen free, toys directives, elements analysis and plating layers analysis. |
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| Quality Guarantee(3) |
| 2）AOI intelligent off-line auto-optical detector_ ALD520 |
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| Machine Specifications： |
| * High stroboscopic RRGB coaxial ring tower four-color light, that can be adjustable according to different test requirements. |
| * Test can be flexibly adjusted to wave soldering, post printing, before reflow, after reflow or keyboard character |
| * Modularized software and hardware, innovative interface, and considerate operation procedure |
| * High seep intellectualized 3CCD color digital camera, integrative vision system |
| * Auto-frame, CAD data input and auto-searching for components programming |
| * Testing speed: capable of satisfying up to 1.5 lines of high-speed SMT production line. |
| * Minimum Component & Pitch: 0201chip & 010C5 upgraded scheme |
| * Seamless connection between SPC and AOI: production checking and quality analyzing anywhere to guarantee good quality. |
| * Off-line programming software that can deal with any ALcadon models. |
| * Remote-control and MSDE central server management mode |
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| Test covering: Solder pasting defectives：paste or skip, misaligned, insufficient, excessive, short, solder short and stain, etc. |
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| Components defectives：missing, misaligned, uneven, tomb stone, billboard, overturned, wrong parts, DCV damage, reversed and etc. |
| Soldering defectives：excessive solder, insufficient solder, solder short and stain and etc |
| Special functions: can work as a coordinator to test red board and keyboard by adjust lights. |
| Minimum Component test: 15pm:0201chip&0.3pl1chIC. |
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| Quality guarantee (4) |
| 3）X-ray Pony(MH3090-S) Function |
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BGA defective detecting
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* BGA defective detecting
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* Solder excessive
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* Shape uneven
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* Air bubble
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* Cold solder
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| * Spatial resolution: 5Um |
| * PCB size ： 250mmX330mm |
| * Max photic inclination: 60° |
| * Testing view： 50x50mm |
| * Magnification times: 8.2-125 times |
| * Image inspection unit：Flat Plate detector |
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| Quality guarantee (5) |
| 4）3D锡膏检查仪（BPC-707ADX） |
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| 技术参数/Parameters |
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测量原理
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Measurement Principle
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3D 白光(white) PSLM PMP（可编程结构光栅相位调制轮廓测量技术）
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测量项目
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Measurements
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Volume, dimension, height, XY misalignment, shape
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检测不良
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Detection of non
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Skip, insufficient solder, excessive solder, solder short, misalignment, switch defective
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类型
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Performing types
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FOV尺寸
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FOV size
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48X34mm
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精度
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Accuracy
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XY direction：10ym height, < 1ym
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重复精度
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Repeatability
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Height：<1ym(4 Sigma)
Dimension：<1%(4 Sigma)
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检测速度
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Detection Speed
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High accuracy mode：2300mm per second
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Mork点
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Mark-point detectime
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1 second/pc
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检测时间
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最大测量
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Maximum Measuring heightM
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500-700ym(PSLM software control)
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高度
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弯曲PCB
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Maximum Measuring
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+5mm
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最大测量高度
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heinhi of PCB warp
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最小焊盘
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Minirm pad spacing
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100ym( based on 150ym height of landpattern)
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间距
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最小测量
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smallest size
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Rectangle：150ym, round：200ym
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大小
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measurement
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最大PCB
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Maximum PCB Size
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300x300mm
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尺寸
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PCB传送
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PCB Transfer Direction
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From left to right or right to left
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方向
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轨道宽度
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Conveyor Width Adjustment
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Automatic or manual
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调整
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